Packaging :
Number of Positions :
Number of Rows :
4 products
IMAGE PART NO. PRICE QUANTITY STOCK MANUFACTURE DESCRIPTION Product Type Packaging Series Product Tradename Part # Aliases Current Rating Termination Style Contact Plating Maximum Operating Temperature Minimum Operating Temperature Housing Material Number of Positions Number of Rows Mounting Angle Contact Material Pitch Voltage Rating Stack Height
470-3075-100
20+
139.4610
40+
127.5120
60+
119.5320
100+
115.5420
VIEW Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept 570 Solder B... Board to Board & Mezzanine Connectors Tray NeXLev Receptacles NeXLev 1 A BGA Gold + 105 C - 40 C Liquid Crystal Polymer (LCP) 300 Position 30 Row Vertical Copper Alloy 1.15 mm 600 V 10 mm, 12 mm, 14 mm, 17 mm
470-2075-600
24+
97.1880
48+
88.8510
72+
83.2860
120+
80.5350
264+
79.9260
VIEW Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls Board to Board & Mezzanine Connectors   NeXLev Receptacles NeXLev 1 A BGA Gold + 105 C - 40 C Liquid Crystal Polymer (LCP) 200 Position 20 Row Vertical Copper Alloy 1.15 mm 600 V 10 mm, 12 mm, 14 mm, 17 mm
470-2075-100
24+
93.0090
48+
85.0290
72+
79.7160
120+
77.0700
264+
74.4030
VIEW
24
Ships today + free overnight shipping
Amphenol TCS Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder B... Board to Board & Mezzanine Connectors Bulk NeXLev Receptacles NeXLev 1 A BGA Gold + 105 C - 40 C Liquid Crystal Polymer (LCP) 200 Position 20 Row Vertical Copper Alloy 1.15 mm 600 V 10 mm, 12 mm, 14 mm, 17 mm
470-3075-600
20+
139.4610
40+
127.5120
60+
119.5320
100+
115.5420
VIEW
40
Ships today + free overnight shipping
Amphenol TCS Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls Board to Board & Mezzanine Connectors Tray NeXLev Receptacles NeXLev 1 A BGA Gold + 105 C - 40 C Liquid Crystal Polymer (LCP) 300 Position 30 Row Vertical Copper Alloy 1.15 mm 600 V 10 mm, 12 mm, 14 mm, 17 mm
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